Several tech startups — Teleskope, Polygraf AI, xMEMS Labs, among others, have announced their venture capital funding.
Teleskope Raises US$ 25 mn
Teleskope has secured a US$ 25 million Series A round, led by M13 with participation from Primary Venture Partners and Lerer Hippeau, bringing its total funding to US$ 32.2 million. Founded and led by Elizabeth Nammour (CEO & Founder), the company’s platform applies autonomous machine-learning pipelines to discover, classify and remediate sensitive data across cloud, SaaS and hybrid environments. Its strategy is to embed human-level intelligence into data security systems, enabling enterprises to safely adopt AI at scale. The investment will accelerate product innovation, go-to-market expansion and scaling of its “agentic” data-security technology.
Polygraf AI Closes US $9.5 mn
Polygraf AI, led by founder and CEO Yagub Rahimov, has raised US$ 9.5 million in a seed round led by Allegis Capital, with participation from Alumni Ventures, DataPower VC and Domino Ventures. The Austin-based startup uses proprietary “Small Language Models” (SLMs) to help enterprises detect and mitigate AI-driven risks like data leakage, deepfakes and synthetic content. The funding will accelerate product development, talent acquisition and go-to-market expansion across defence, intelligence, finance and large-scale enterprise sectors. Their on-prem, explainable AI security approach aims to enable trusted enterprise AI adoption in high-stakes environments.
xMEMS Labs Raises US$ 21 mn
xMEMS Labs, founded and led by Joseph Jiang (CEO & Co-Founder), has secured a US$ 21 million Series D round led by Boardman Bay Capital Management, with additional backing from Cloudview Capital, CDIB‑TEN Capital, Harbinger Venture Capital and SIG Asia Investments. The investment will support mass production and global commercialisation of breakthrough piezoMEMS solid-state loudspeakers and µCooling fan-on-a-chip solutions for AI-enabled consumer electronics. The technology addresses the hardware constraints of next-gen devices by delivering enhanced audio, thermals and form factor at scale.
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