Samsung Electronics has started mass production of 256 GB embedded Universal Flash Storage (eUFS) solution targeting big automotive companies.
Samsung’s automotive 256GB eUFS meets specifications from the JEDEC UFS 3.0 standard, for the first time in the industry.
Samsung introduced the automotive industry’s first 128GB eUFS in September, 2017 for global automotive manufacturers.
The newly launched 256GB eUFS will assist automotive companies to prepare the market for Advanced Driver Assistance Systems (ADAS), next-generation infotainment systems and new-age dashboards in luxury vehicles. Samsung will be targeting big automobile companies in the initial phase and will extend the product to all in the next stage.
Samsung’s 256GB eUFS extends the temperature range to between -40°C and 105°C for both operational and power-saving modes. Warranties for conventional embedded multimedia card (eMMC) 5.1 solutions cover -25°C to 85°C for vehicles in operation and -40°C to 85°C when in idle or power-saving mode.
“With the new temperature threshold for automobile warranties, automotive manufacturers can now design-in memory that’s even well suited for extreme environments and know they will be getting highly reliable performance,” said Kyoung Hwan Han, vice president of NAND marketing at Samsung Electronics.
Samsung’s 256GB eUFS can endure the new temperature specification, despite the heat-sensitive nature of memory storage. Its temperature notification feature supports the sensor to notify the host application processor (AP) when the device temperature exceeds 105°C or any pre-set level. The AP would regulate its clock speed to lower the temperature to an acceptable level.
Sequential reads for the 256GB eUFS can reach 850 megabytes per second (MB/s), which is at the high end of the current JEDEC UFS 2.1 standard, and random read operations come in at 45,000 IOPS. A data refresh feature speeds up processing and enables system reliability by relocating older data to other less-used cells.