TrendForce analysts have identified main NVIDIA strategies behind the move to rebrand its Blackwell Ultra products to the B300 series.
NVIDIA plans to promote the B300 and GB300 lines — which utilize CoWoS-L technology — for boosting the demand for advanced packaging solutions.
Rebranding of Blackwell Products: NVIDIA has rebranded its Blackwell Ultra products under the B300 series to align with its strategic goals, enhancing product clarity and differentiation. This rebranding reflects an adaptation to changing market demands, especially in high-performance computing and AI.
CoWoS-L Technology Integration: NVIDIA is pushing its new B300 and GB300 series, both of which utilize CoWoS-L technology. This is an advanced packaging solution that integrates high-performance chips, allowing for better scalability and efficiency in data centers. This technology is crucial in supporting the next generation of AI and cloud workloads, especially for major cloud service providers (CSPs).
Focus on Advanced Packaging Solutions: The emphasis on CoWoS technology shows NVIDIA’s push toward more complex, high-performance packaging for its chips. This innovation addresses the growing need for advanced solutions that handle increasing AI and data center workloads, with a forecasted rise in demand for CoWoS by over 10% annually.
Transition to B300A Series: NVIDIA’s shift from the B200A to the B300A reflects a refinement of its product segmentation. This move allows for more targeted offerings tailored to server OEMs and CSPs, balancing performance and cost. The B300A aims to meet specific client needs with mass production planned for mid-2025.
Adoption of HBM3e 12hi Memory: A significant innovation in the B300 series is the integration of HBM3e 12hi memory stacks, which represent the cutting edge of high-bandwidth memory technology. This allows for faster data processing and improved efficiency, especially crucial for AI models and large-scale cloud operations. NVIDIA’s growing dominance in the HBM market is expected to rise to over 70% by 2025.
NVL72 Rack Solution Optimization: NVIDIA’s investment in improving its NVL72 rack solutions, with support for liquid cooling, underscores its commitment to enhancing server performance. This is aimed at helping large clients like AWS and Meta transition to more powerful systems, bolstering NVIDIA’s standing in the data center market.
Increased Shipment of High-End GPUs: NVIDIA is forecasting significant growth in its high-end GPU shipments, with a projected increase to 50 percent of total shipments in 2024, up from the previous year. The Blackwell platform is expected to boost this further to 65 percent in 2025, reflecting the growing demand for premium AI and machine learning solutions.
These innovations position NVIDIA to maintain its leadership in AI, advanced packaging, and high-performance computing for data centers, further boosting its market share and technological influence.
