Micron Technology is intensifying its focus on artificial intelligence (AI) by advancing high-bandwidth memory (HBM) solutions that are essential to handling the soaring data demands of AI training and inference.
The company has announced the shipment of 36GB HBM4 samples — built on its proven 1-beta DRAM process and advanced 12-high stack packaging — to key AI customers. This marks a significant leap in memory performance and efficiency tailored specifically for next-generation AI platforms.
Micron’s data center DRAM revenue reached a new record in fiscal Q2. High-bandwidth memory (HBM) revenue grew more than 50 percent sequentially to a new milestone of over $1 billion of quarterly revenue. LP DRAM for the data center also exceeded the billion-dollar milestone for the quarter. Micron remains the only company in the world to ship low-power DRAM into the data center in high volume, showcasing its innovation and partnership with customers.
Micron’s HBM4
Micron’s HBM4 is engineered to meet the extreme throughput and efficiency requirements of generative AI and large language models. With a 2048-bit interface and memory bandwidth exceeding 2.0 TB/s per stack, HBM4 delivers over 60 percent performance improvement compared to its predecessor HBM3E. This level of speed and parallelism is crucial for accelerating inference in complex models, enabling faster decision-making and real-time responsiveness in AI systems.
Power efficiency is another critical advantage. HBM4 consumes over 20% less power than Micron’s already efficient HBM3E, a key factor for reducing operational costs and thermal footprints in hyperscale data centers. As AI workloads scale across sectors like healthcare, finance, and transportation, this efficiency helps organizations deliver AI services sustainably and at scale.
Micron’s advancements with HBM4 are part of a broader strategy to lead in AI memory solutions. From the cloud to the edge, the company’s portfolio is designed to turn data into intelligence, acting as a foundational layer for AI innovation.
According to Raj Narasimhan, SVP and GM of Micron’s Cloud Memory Business Unit, the company’s HBM4 development is closely aligned with customers’ AI roadmaps, ensuring timely integration into upcoming platforms.
As Micron prepares for full-scale HBM4 production in 2026, its leadership in AI-optimized memory solutions positions it as a critical enabler of the AI revolution — powering faster, more efficient, and more intelligent computing systems worldwide.
Rajani Baburajan
