Latest from Samsung Tech Day 2018

Samsung Electronics, the number one semiconductor technology maker – head of Intel, announced several additions to its semiconductor business.
Samsung Tech Day 2018“Bringing 7nm EUV into production is an incredible achievement. Announcements of SmartSSD and 256GB 3DS RDIMM represent performance and capacity breakthroughs that will continue to push compute boundaries,” said JS Choi, president, Samsung Semiconductor, at the Samsung Tech Day in US.

# 7nm EUV process node from Samsung’s Foundry Business

# SmartSSD, a field programmable gate array (FPGA) SSD

# QLC-SSD for enterprise and datacenters that offer 33-percent more storage per cell than TLC-SSD

# 256 GB 3DS RDIMM to double current maximum capacity

Samsung EUV fab under construction in Hwaseong, South KoreaThe semiconductor company started wafer production of Samsung’s 7nm LPP (Low Power Plus) EUV process node – at Samsung’s S3 Fab in Hwaseong, Korea.

The 7LPP EUV process technology provides great advances, including 40 percent area reduction, 50 percent dynamic power reduction and 20 percent performance increase over 10nm processes.

Samsung’s SmartSSD, quad-level cell (QLC)-SSD, 256GB 3DS RDIMM as well as High Bandwidth Memory (HBM) 2 Aquabolt will enable datacenter operators to scale at faster speeds while reducing costs.

Samsung’s flash memory products for future datacenters will include Key Value (KV)-SSD and Z-SSD. KV-SSD eliminates block storage inefficiency, reducing latency and allowing datacenter performance to scale evenly when CPU architectures max out.

The company’s next Z-SSD will be the fastest flash memory ever introduced, with dual port high availability, ultra-low latency and a U.2 form factor, designed to meet the emerging needs of enterprise clients. Z-SSD will also feature a PCIe Gen 4 interface with a blazing-fast 12-gigabytes-per-second (GB/s) sequential read, which is 20 times faster than today’s SATA SSD drives.

The latest Samsung solutions will enable the development of machine learning and AI technologies.

Enterprise products on display at Tech Day included D1Y 8Gb DDR4 Server DRAM and 256GB 3DS RDIMM. Samsung’s dual-port x4 PCIe Gen 4 32TB SSD offers 10GB/s performance. Samsung’s 1Tb QLC-SSD presents better storage option for enterprise clients with competitive efficiency when compared to HDD.

Samsung expects to secure additional capacity by 2020 with a new EUV line for customers who need high-volume manufacturing for next-generation chip designs.

“Commercialization of EUV technology is a revolution for the semiconductor industry and will have a huge impact on our everyday lives,” said Peter Jenkins, vice president of corporate marketing at ASML.

Related News

Latest News

Latest News