Intel Corporation said it will invest $3.5 billion to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including Foveros, Intel’s 3D packaging technology.
The multiyear investment is expected to create at least 700 high-tech jobs and 1,000 construction jobs and support an additional 3,500 jobs in the state. Planning activities begin immediately, with construction expected to start in late 2021.
Foveros advanced 3D packaging technology enables Intel to build processors with compute tiles stacked vertically, rather than side-by-side, providing greater performance in a smaller footprint. It also allows Intel to mix and match compute tiles to optimize for cost and power efficiency. The move from system-on-chip to “system on package” will enable Intel to meet increasing computing performance needs for artificial intelligence, 5G and the edge.
Intel’s global factory network enables product optimization, improved economics and supply resilience. Investing in the company’s manufacturing operations is a key component of its recently announced IDM 2.0 strategy.
The technologies developed and manufactured at the Rio Rancho site — Intel Optane technology, embedded multi-die interconnect bridge and Intel silicon photonics technology — play important roles in Intel’s new era of innovation by simplifying and optimizing semiconductor memory, packaging, and connectivity.
Since 1980, Intel has invested $16.3 billion in capital to support its New Mexico operations and currently employs more than 1,800 people at the site. Its annual economic impact in the state is $1.2 billion, based on 2019 data.