Intel CEO Pat Gelsinger and Intel’s business leaders outlined key elements of the company’s strategy and path for long-term growth at 2022 Investor Meeting.
Accelerated Computing Systems and Graphics Group
Intel said the Accelerated Computing Systems and Graphics Group (AXG) is on track to ship products across its three segments and deliver more than $1 billion in revenue in 2022. As a growth engine for Intel, AXG’s three segments together will approach $10 billion of revenue for Intel by 2026.
Visual Compute Roadmap and Strategy
Intel Arc Graphics Timing and Roadmap Update – AXG expects to ship more than 4 million discrete GPUs in 2022. OEMs are introducing notebooks with Intel Arc graphics, code-named Alchemist, for sale in the first quarter of 2022. Intel will ship add-in cards for desktops in the second quarter and workstations by the third quarter. Architecture work has begun on Celestial, a product that will address the ultra-enthusiast segment.
Project Endgame – Project Endgame will enable users to access Intel Arc GPUs through a service for an always-accessible, low-latency computing experience. Project Endgame will be available later this year.
Super Compute Roadmap and Strategy
More than 85 percent of the world’s supercomputers run on Intel Xeon processors. AXG is extending to higher compute and memory bandwidth and will deliver a leadership CPU and GPU roadmap to power high performance computing (HPC) and AI workloads. To date, Intel expects more than 35 HPC-AI design wins from top OEMs and CSPs. Additionally, AXG has set a course that paves the way to zetta-scale by 2027.
Sapphire Rapids with High-Bandwidth Memory (HBM) – HBM integrated into the package with Sapphire Rapids offers applications up to 4x more memory bandwidth, providing a generational improvement of 2.8x over Intel 3rd Gen Xeon processors. Sapphire Rapids with HBM outperforms competing solutions by up to 2.8x.
AXG is on track to deliver Ponte Vecchio GPUs for the Aurora supercomputer program later this year. Ponte Vecchio achieved leadership performance results with up to 2.6x more performance compared with the leading market solution on a complex financial services workload.
Arctic Sound-M brings the industry’s first hardware-based AV1 encoder into a GPU to provide 30 percent bandwidth improvement and includes the industry’s only open-sourced media solution. The media and analytics supercomputer enables leadership transcode quality, streaming density and cloud gaming. Arctic-Sound M is sampling to customers and will ship by mid-2022.
Falcon Shores is a new architecture that will bring x86 and Xe GPU together into a single socket. This architecture is targeted for 2024 and projected to deliver benefits of more than 5x performance-per-watt, 5x compute density, 5x memory capacity and bandwidth improvements.
AXG’s Custom Compute Group will build tailored products for emerging workloads such as blockchain, supercomputing at the edge, premium infotainment for cars, immersive displays and more.
TECHNOLOGY DEVELOPMENT
Intel remains on track to reclaim transistor performance per watt leadership by 2025. Intel’s advanced test and packaging technologies give it unmatched industry leadership that benefits its products and foundry customers and will play a critical part in the pursuit of Moore’s Law. Continuous innovation is the cornerstone of Moore’s Law, and innovation is very much alive and well at Intel.
Process – Intel 7 is in production and shipping in volume with the launch of 12th Gen Intel Core processors and additional products coming in 2022. Intel 4, our implementation of extreme ultraviolet (EUV) lithography, will be manufacturing-ready in the second half of 2022. It delivers an approximate 20 percent increase in transistor performance per watt. Intel 3, with additional features, delivers a further 18 percent performance per watt and will be manufacturing-ready in the second half of 2023.
Ushering in the Angstrom Era with RibbonFET and PowerVia, Intel 20A will deliver up to a 15 percent performance per watt improvement and will be manufacturing-ready in the first half of 2024. Intel 18A delivers an additional 10 percent improvement and will be manufacturing-ready in the second half of 2024.
In 2022, Intel will ship leadership packaging technologies in Sapphire Rapids and Ponte Vecchio and start risk production on Meteor Lake. Foveros Omni and Foveros Direct, our advanced packaging technologies unveiled at Intel Accelerated in July 2021, will be manufacturing-ready in 2023.
