Chipset maker Intel has presented details about the company’s EMIB (Embedded Multi-die Interconnect Bridge) packaging technology.
EMIB facilitates high-speed communication between multiple die in-package, and is a key component of Intel’s mix-and-match heterogeneous computing strategy, Intel said at the annual Hot Chips Conference in Cupertino, California.
EMIB is used in Intel Stratix 10 FPGAs and 8th Gen Intel Core processors with Radeon Graphics, Intel said.
