Intel today announced the promotion of Diane Bryant, Murthy Renduchintala and Stacy Smith to group presidents and Renduchintala as chief engineering officer.
“Their groups are a significant part of Intel’s business and are instrumental to driving Intel’s growth strategy and flawless execution going forward,” said Intel CEO Brian Krzanich.
Diane Bryant, who joined Intel in 1985, will be the group president of the Data Center Group (DCG).
She has been leading DCG since 2012 and is responsible for the group’s P&L, strategy and product development. The organization consists of the technology for server, storage and network infrastructure to serve the cloud service providers, communications service providers, enterprise and government organizations.
Murthy Renduchintala, who joined Intel in November 2015, will be the group president, Client and Internet of Things Business & Systems Architecture Group (CISA), and appointed chief engineering officer. The CISA division is responsible for aligning technology, engineering, product design and business direction across the client device and IoT segments.
Stacy Smith, who joined Intel in 1988, will be the group president of Manufacturing, Operations and Sales.
He has overseen the company’s Technology and Manufacturing Group and its worldwide sales organization since last fall. Previously, Smith served nine years as Intel’s chief financial officer.