Intel — at Architecture Day — has conducted demonstration of a range of 10nm-based systems in development for PCs, data centers and networking, and previewed other technologies targeted at workloads.
The company shared its technical strategy focused on six engineering segments. These technologies lay the foundation for a more diverse era of computing in an addressable market opportunity of more than $300 billion by 2022.
Intel demonstrated a new 3D packaging technology — Foveros which brings the benefits of 3D stacking to enable logic-on-logic integration.
Foveros is expected to extend die stacking beyond traditional passive interposers and stacked memory to high-performance logic, such as CPU, graphics and AI processors.
Intel expects to launch products using Foveros beginning in the second half of 2019. The first Foveros product will combine a high-performance 10nm compute-stacked chiplet with a low-power 22FFL base die.
Intel introduced Sunny Cove, Intel’s next-generation CPU microarchitecture to increase performance per clock and power efficiency for general purpose computing tasks, and includes new features to accelerate special purpose computing tasks like AI and cryptography.
Intel unveiled new Gen11 integrated graphics with 64 enhanced execution units, more than double previous Intel Gen9 graphics (24 EUs), designed to break the 1 TFLOPS barrier. The new integrated graphics will be delivered in 10nm-based processors beginning in 2019.
The new integrated graphics architecture is expected to double the computing performance-per-clock compared to Intel Gen9 graphics. This architecture is designed to increase game playability.
Intel reaffirmed its plan to introduce a discrete graphics processor by 2020.
Intel announced the One API project to simplify the programming of diverse computing engines across CPU, GPU, FPGA, AI and other accelerators. A public project release is expected to be available in 2019.
Intel said the company’s new stacking technology will be available in the second half of next year.
Intel would be the first company to stack the logic chips that handle computing tasks, Raja Koduri, Intel’s chief of chip architecture, said.
Intel said its technology to stack computing circuits on top of each other and wire them together with speedy connections, enabling it to pack more onto a single chip.
