Telit, a technology company for the Internet of Things (IoT) business, has launched the world’s first hybrid IoT modules that combine 3G Cellular, Wi-Fi, Bluetooth and GNSS into a single package.
The new HE922-3GR and WE922-3GR smart module series in the xE922 family use the Intel Atom x3 SoC Processor technology with a self-contained quad-core processing engine and comprehensive I/O resources.
These IoT modules deliver an end-to-end solution ideal for providers in a range of application areas including healthcare, vending, POS, public parking, smart buildings, smart grid and the industrial internet of things.
“When you look at how complexity of designing devices with multiple chipsets is impacting cost and time-to market, you can appreciate the power of these all-in-one hybrid modules,” said Ronen Ben-Hamou, executive vice president of Products and Solutions at Telit.
The WE922-3GR and HE922-3GR, which offer 34x40mm LGA footprint, include 2.4GHz Wi-Fi 802.11 b/g/n and Bluetooth 4.0 LE. The embedded global positioning receiver in the modules is compatible with GPS and GNSS constellations.
Both of them integrate the functionality of an entire processor board inside the 441-pin package based on the 1.2GHz, 64-bit, quad-core Intel Atom x3 processor series and include 8GB memory, sensor inputs, battery charger logic, analog speaker and microphone audio connections, interface for primary and secondary cameras and direct support for high-resolution display with touch screen and/or keyboard.
The application development environment is based on Android and Yocto Linux enabling access and reuse of vast libraries of functions and applications across all industries and segments. HE922-3GR includes quad-band HSPA+ cellular connectivity delivering 21Mbps download data rate with fallback to 2G. The upload data rate is 5.76Mbps.
Telit is offering the WE922-3GR and HE922-3GR modules in two environmental grade variants. The commercial grade has an operating temperature range of 0°C to +70°C; the extended grade has an operating temperature range of -40°C to +85°C. The modules can be connected to an SD card and provide connections for a USB 2.0 port with OTG, two UART and SPI ports and I2C support.
A developers’ kit is also available for the modules which includes a high-resolution touch screen with embedded cameras and audio, all the necessary antennas and a power supply.
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