Siemens AG and Intel Corporation have formalized a memorandum of understanding (MoU) to advance digitalization and sustainability in microelectronics manufacturing.
This collaboration, focusing on evolving factory operations, cybersecurity, and supporting global industry resilience, underscores the critical role of semiconductors in modern economies.
Cedrik Neike, CEO of Digital Industries at Siemens AG, emphasized the significance of semiconductors and underscored the collaboration’s goal to expedite semiconductor production by leveraging Siemens’ IoT-enabled hardware and software along with Intel’s capabilities.
The MoU outlines key collaboration areas, emphasizing energy management optimization and addressing carbon footprints throughout the semiconductor value chain. Initiatives include exploring the use of “digital twins” for manufacturing facilities, standardizing solutions for enhanced efficiency, and minimizing energy use through advanced modeling.
Intel and Siemens will work together to explore modeling solutions providing insights into product-related emissions, contributing to industry efforts to reduce collective footprints. Keyvan Esfarjani, EVP and chief global operations officer at Intel, emphasized the need for a globally balanced, sustainable, and resilient semiconductor supply chain to meet the growing chip demand.
This collaboration aims to utilize Siemens’ automation solutions to enhance efficiency and sustainability in semiconductor infrastructure, facilities, and factory operations.
Sustainable practices across the semiconductor life cycle, including design, manufacturing, operation, efficiency, and recycling, are deemed critical, and the Siemens-Intel partnership aims to address these challenges, driving positive change towards achieving net-zero greenhouse gas emissions, the company said.
