Intel and Submer announced a collaboration to co-develop the Precision Immersion Cooling Fluid Cloud for use in data centers.
Intel and Submer are using Intel Xeon-based immersion-optimized server boards and Submer’s precision cooling technique to demonstrate the reuse of high-grade waste heat generated by compute elements in data centers.
“Our collaboration with Submer will allow us to address all stages of the immersion cooling value chain and offer a sustainable solution that will make a difference for our mutual customers,” Mohan Kumar, Intel Fellow in the Datacenter and AI Group, said.
“We’re setting the foundations for server OEMs and operators to have a clear roadmap to transform the data center industry and achieve a significantly reduced operational footprint,” said Daniel Pope, co-founder and CEO of Submer.
Intel will focus efforts on an open-standard offering that supports scalable data center deployments from cloud to edge and work with the industries that will deploy these solutions.